Module and method for producing module

A module producing method comprising:

• a step of mounting an electronic component on one principal surface of a wiring substrate;
• a step of arranging a resin sealing jig on a peripheral edge of the one principal surface of the wiring substrate to surround the electronic component;
• a step of filling, as an underfill resin, a liquid resin containing a filler into a region surrounded by the resin sealing jig, the filler having a particle diameter that is smaller than a spacing between the one principal surface of the wiring substrate and the electronic component;
• a step of providing an underfill resin layer comprising steps of solidifying the liquid resin and removing the resin sealing jig;
• and
• a step of covering the underfill resin layer and the electronic component with a molded resin layer.

A module producing method comprising:

• a step of mounting an electronic component on one principal surface of a wiring substrate;
• a step of arranging a resin sealing jig on a peripheral edge of the one principal surface of the wiring substrate to surround the electronic component;
• a step of applying, as an underfill resin, a powdery resin containing a filler into a region surrounded by the resin sealing jig, the filler having a particle diameter that is smaller than a spacing between the one principal surface of the wiring substrate and the electronic component;
• a step of conditioning the powdery resin such that the powdery resin is evenly distributed within the region surrounded by the resin sealing jig, and that the powdery resin is filled into the gap between the one principal surface of the wiring substrate and the electronic component;
• a step of providing an underfill resin comprising steps of melting the powdery resin, solidifying the melted powdery resin, and removing the resin sealing jig;
• and
• a step of covering the underfill resin layer and the electronic component with a molded resin layer.