Adhesive composition and adhesive sheet, and hardened article and semiconductor device using same
AssigneeToray Industries, Inc.
InventorsAkira SHIMADA, Koichi AOKI
Life of this patent
Estimating the term…
Abstract
The purpose of the present invention is to provide an adhesive composition having high heat conductivity and excellent adhesion, in which the dispersibility of a heat-conductive filler is controlled, and in which thermal stress during cooling/heating cycle testing can be alleviated. An adhesive composition containing a soluble polyimide (A), an epoxy resin (B), and a heat-conductive filler (C), the adhesive composition characterized by containing three types of diamine residues having a specific structure, and in that the content of the epoxy resin (B) is 30-100 parts by weight with respect to 100 parts by weight of the soluble polyimide (A).
Claims15
An adhesive composition containing an organic-solvent-soluble polyimide (A), an epoxy resin (B) and a thermally conductive filler (C), wherein the organic-solvent-soluble polyimide (A) contains a diamine residue having a structure represented by the following general formula (1), a diamine residue represented by the following general formula (2) and a diamine residue represented by the following general formula (3), and the content of the epoxy resin (B) is not less than 30 parts by weight and not more than 100 parts by weight with respect to 100 parts by weight of the organic-solvent-soluble polyimide (A):
- in the general formula (1), X represents an integer of 1 to 10 and n represents an integer of 1 to 20;
- in the general formula (2), m represents an integer of 1 to 30, and R5 and R6 may be the same or different and represent an alkylene group having 1 to 30 carbon atoms or a phenylene group, R1 to R4 each may be the same or different and represent an alkyl group having 1 to 30 carbon atoms, a phenyl group or a phenoxy group;
A hardened article obtained by hardening an adhesive composition containing an organic-solvent-soluble polyimide (A), an epoxy resin (B) and a thermally conductive filler (C), wherein the organic-solvent-soluble polyimide (A) contains a diamine residue having a structure represented by the following general formula (1), a diamine residue represented by the following general formula (2) and a diamine residue represented by the following general formula (3), and the content of the epoxy resin (B) is not less than 30 parts by weight and not more than 100 parts by weight with respect to 100 parts by weight of the organic-solvent-soluble polyimide (A):
- in the general formula (1), X represents an integer of 1 to 10 and n represents an integer of 1 to 20;
- in the general formula (2), m represents an integer of 1 to 30, and R5 and R6 may be the same or different and represent an alkylene group having 1 to 30 carbon atoms or a phenylene group, R1 to R4 each may be the same or different and represent an alkyl group having 1 to 30 carbon atoms, a phenyl group or a phenoxy group;
A power IC packaging which is obtained by bonding a radiating fin using the way of thermocompression to a lead frame, which is made of copper, of a semiconductor device having the power IC mounted.
Dependencies are inferred from the claim text.