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US 2015/0318199 A1Published application
Thin substrate electrostatic chuck system and method
AssigneeInfineon Technologies AG
InventorsEwald Wiltsche, Peter Zupan
Life of this patent
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Abstract
In various aspects of the disclosure, a semiconductor substrate processing system may include an electrostatic chuck for holding a semiconductor substrate attached to an electrically insulating carrier; and an AC power supply electrically coupled to the electrostatic chuck.
Claims19
-20. (canceled)
A processing system, comprising:
- an electrostatic chuck for holding a workpiece, the workpiece comprising a semiconductor substrate attached to an electrically insulating carrier, the electrically insulating carrier having a thickness of at least 0.2 mm, wherein, when the electrostatic chuck holds the workpiece, the electrically insulating carrier of the workpiece is disposed between the electrostatic chuck and the semiconductor substrate of the workpiece;
- an AC power supply electrically coupled to the electrostatic chuck wherein the AC power supply provides a voltage of at least 1 kV peak to peak;
- wherein the workpiece is held against the electrostatic chuck by an electrostatic force generated by the provided voltage.
A method of manufacturing a device, the method comprising:
- providing a semiconductor substrate;
- attaching the semiconductor substrate to an electrically insulating carrier, thereby forming a workpiece, the electrically insulating carrier having a thickness of at least 0.2 mm;
- supporting the workpiece, which comprises the semiconductor substrate and the electrically insulating carrier, with an electrostatic chuck, the electrically insulating carrier being disposed between the electrostatic chuck and the semiconductor substrate of the workpiece;
- wherein the workpiece is held against the electrostatic chuck by an electrostatic force generated by a voltage supplied to the electrostatic chuck;
- wherein a voltage supplied to the electrostatic chuck is at least 1 kV peak to peak.
2 more elements
Dependencies are inferred from the claim text.