Substrate liquid treatment apparatus and substrate liquid treatment method
AssigneeTokyo Electron Limited
InventorsMasahiro FUKUDA, Akihiro KUBO, Taro YAMAMOTO, Kenzi YADA, Atsushi OOKOUCHI
Life of this patent
Estimating the term…
Loading patent…
AssigneeTokyo Electron Limited
InventorsMasahiro FUKUDA, Akihiro KUBO, Taro YAMAMOTO, Kenzi YADA, Atsushi OOKOUCHI
Estimating the term…
A substrate liquid treatment apparatus comprises a chuck (13) that holds and rotates a wafer, a back surface purging nozzle (15) that discharges a purge gas toward the back surface of the wafer, and a periphery purging nozzle 16 that discharges the purge gas onto the back surface of the wafer. The back surface purging nozzle has a slit-like opening part extending from a central side to a peripheral side of the substrate in a plan view. Vertical distance between the slit-like opening part and the substrate held by the substrate holding unit increases as approaching an end of the opening part on the central side of the substrate. The periphery purging nozzle discharges the purge gas, toward a central part of the substrate, toward a region on the back surface of the substrate, which region is located radially outside an end of the slit-like opening part of the back surface purging nozzle and radially inside an peripheral edge of the substrate.
A substrate liquid treatment apparatus that supplies a cleaning liquid to a back surface of a substrate to perform a cleaning treatment, said apparatus comprising:
A substrate liquid treatment method that performs a liquid treatment that treats a surface of a substrate by supplying a treatment liquid to the surface or a brush cleaning treatment that cleans a substrate with a brush and also performs a cleaning treatment that cleans a back surface of a substrate by supplying a cleaning liquid to the back surface, said method comprising:
Dependencies are inferred from the claim text.