Substrate Pad Structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHao-Juin Liu, Chita Chuang, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen
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Abstract
A structure comprises a plurality of top pads protruding over a top surface of a package substrate, wherein a top pad comprises a first half-circle portion, a second half-circle portion and a first rectangular portion between the first half-circle portion and the second half-circle portion, a plurality of bottom pads embedded in the package substrate, wherein a bottom pad comprises a third half-circle portion, a fourth half-circle portion and a second rectangular portion between the third half-circle portion and the fourth half-circle portion and a plurality of vias coupled between the top pads and their respective bottom pads.
Claims20
A structure comprising:
- a plurality of top pads protruding over a top surface of a package substrate, wherein at least one top pad comprises a first half-circle portion, a second half-circle portion and a first rectangular portion between the first half-circle portion and the second half-circle portion;
- a plurality of bottom pads embedded in the package substrate, wherein at least one bottom pad comprises a third half-circle portion, a fourth half-circle portion and a second rectangular portion between the third half-circle portion and the fourth half-circle portion;
- and
- a plurality of vias coupled between the top pads and their respective bottom pads.
A device comprising:
- a semiconductor die comprising active circuits;
- a metal bump formed on a first side of the semiconductor die, wherein the active circuits are located adjacent to the first side;
- and
- a package substrate coupled to the semiconductor die through the metal bump, wherein the package substrate comprises:
- a plurality of active circuits;
- a top pad protruding over a top surface of the package substrate, wherein the top pad comprises a first half-circle portion, a second half-circle portion and a first rectangular portion between the first half-circle portion and the second half-circle portion;
- a bottom pad embedded in the package substrate, wherein the bottom pad comprises a third half-circle portion, a fourth half-circle portion and a second rectangular portion between the third half-circle portion and the fourth half-circle portion;
- and
- a via coupled between the top pad and the bottom pad.
A method comprising:
- embedding a plurality of bottom pads in a package substrate comprising a plurality of active circuits, wherein at least one bottom pad comprises a first half-circle portion, a second half-circle portion and a first rectangular portion between the first half-circle portion and the second half-circle portion;
- connecting the bottom pads with a plurality of vias, wherein a via is connected to a corresponding bottom pad;
- and
- forming a plurality of top pads over the vias, wherein at least one top pad comprises a third half-circle portion, a fourth half-circle portion and a second rectangular portion between the third half-circle portion and the fourth half-circle portion, and wherein the at least one top pad is connected to the at least one bottom pad through a corresponding via.
Dependencies are inferred from the claim text.