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US 2015/0318165 A1Published application
Method of making wafer assembly
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsI-Hsiung HUANG, Heng-Hsin LIU, Heng-Jen LEE, Chin-Hsiang LIN
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Abstract
A method including bonding a process wafer having integrated circuits and a carrier wafer having at least one alignment mark to form a wafer assembly. The method further includes aligning the wafer assembly using the at least one alignment mark of the carrier wafer.
Claims20
A method, comprising:
- bonding a process wafer having integrated circuits and a carrier wafer having at least one alignment mark to form a wafer assembly;
- and
- aligning the wafer assembly using the at least one alignment mark of the carrier wafer.
A method of forming a semiconductor device, the method comprising:
- forming an integrated circuit on a process wafer;
- aligning the carrier wafer and the process wafer using an alignment mark on the carrier wafer;
- and
- bonding the process wafer to a carrier wafer, wherein the carrier wafer has a thickness greater than 2000 μm.
1 more element
A method of forming a semiconductor device, the method comprising:
- forming a wafer assembly, wherein forming the wafer assembly comprises bonding a process wafer to a carrier wafer, wherein the carrier wafer has a thickness greater than 2000 μm;
- aligning the carrier wafer and the process wafer using an alignment mark on the carrier wafer;
- performing a back-end process on the wafer assembly;
- and
- packaging the wafer assembly.
2 more elements
Dependencies are inferred from the claim text.