System and method for treating substrate
AssigneeSemes Co., Ltd.
InventorJe Ho KIM
Life of this patent
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Abstract
Provided are a system and a method for treating a substrate. The substrate treating system may include a process chamber including a body with an open top and a dielectric window hermetically sealing the top of the body from an outside, a supporting unit provided in the process chamber to support a substrate, a gas-supplying unit supplying a process gas into the process chamber, a plasma source provided outside the process chamber to generate plasma from the process gas supplied into the process chamber, and a heating unit heating the dielectric window. The heating unit may include a heater and a thermally conductive layer provided on one of surfaces of the dielectric window.
Claims20
A substrate treating system, comprising:
- a process chamber including a body with an open top and a dielectric window hermetically sealing the top of the body from an outside;
- a supporting unit provided in the process chamber to support a substrate;
- a gas-supplying unit supplying a process gas into the process chamber;
- a plasma source provided outside the process chamber to generate plasma from the process gas supplied into the process chamber;
- and
- a heating unit heating the dielectric window,
- wherein the heating unit comprises:
- a heater;
- and
- a thermally conductive layer provided on one of surfaces of the dielectric window.
A method of treating a substrate, comprising supplying a process gas into a process chamber with a top-open body and a dielectric window, applying an electric power to an antenna provided outside the process chamber to generate plasma from the process gas in the process chamber, and then treating a substrate with the plasma,
- wherein the method further comprises heating the dielectric window, before or during the treating of the substrate, and
- the heating of the dielectric window is performed using a heat energy, which is generated by a heater and is supplied to an edge portion of the dielectric window from the heater, and a fraction of which is transmitted to an entire region of the dielectric window through a thermally conductive layer in contact with the dielectric window.
Dependencies are inferred from the claim text.