Reflowable Circuit Protection Device

A circuit protection device comprising:

• a base assembly comprising:
• a first electrode;
• a second electrode;
• a dielectric separating the first and second electrodes;
• and
• a metal layer formed on at least a portion of an upper surface of each of the first electrode and second electrode such that the metal layer forms a conductive bridge between the first and second electrodes, wherein the metal layer has a melting point that is less than a reflow temperature;
• a cap covering the base assembly;
• and
• a means for activating the circuit protection device after reflow in response to a force applied to the cap in a first direction defined from a top of the cap towards the base assembly.

A method of manufacturing a circuit protection device, comprising:

• providing a first electrode, a second electrode, and a dielectric interposed between the first and second electrodes;
• providing a metal layer on at least a portion of an upper surface of each of the first electrode and second electrode such that the metal layer forms a conductive bridge between the first and second electrodes;
• forming a coating over the metal layer, wherein the coating comprises a material that prevents the metal layer from pulling apart when the metal layer melts;
• subjecting a structure comprising the first electrode, second electrode, dielectric, metal layer and coating to a reflow process in a reflow oven, wherein a melting point of the metal layer is less than a temperature of the reflow process;
• and
• applying a flux over the metal layer after the reflow process.

A circuit protection device comprising:

• a base assembly comprising:
• a first electrode;
• a second electrode;
• a dielectric separating the first and second electrodes;
• and
• a metal layer formed on at least a portion of an upper surface of each of the first electrode and second electrode such that the metal layer forms a conductive bridge between the first and second electrodes, wherein the metal layer is held in place above the first and second electrodes by a metal having a melting point that is less than a reflow temperature;
• a cap covering the base assembly;
• and
• a means for activating the circuit protection device after reflow in response to a force applied to the cap in a first direction defined from a top of the cap towards the base assembly.