Conductive microparticles
AssigneeToray Industries, Inc.
InventorsItaru Asano, Ayano Ohno, Hiroshi Takezaki
Life of this patent
Estimating the term…
Abstract
Conductive microparticles, each are composed of a polymer microparticle and a conductive layer formed by coating the surface of the polymer microparticle with a metal. The conductive microparticles have an elastic modulus (E) at 5% displacement of 1-100 MPa. Especially when the conductive microparticles have a shape recovery ratio (SR) of 0.1-13% under a load of 9.8 mN, a particle size distribution index of 1-3 and a particle size of 0.1-100 μm, the conductive microparticles can exhibit excellent conduction reliability in applications such as conductive adhesives for flexible boards.
Claims17
-6. (canceled)
Conductive microparticles, each comprising a polymer microparticle and a conductive layer formed by coating a surface of the polymer microparticle with a metal, wherein an elastic modulus (E) at 5% displacement of said conductive microparticles is 1-100 MPa.
Dependencies are inferred from the claim text.