Copper Feature Design for Warpage Control of Substrates
AssigneeInternational Business Machines Corporation
InventorsEdmund Blackshear, Anson Jay Call, Vijayeshwar Das Khanna, Douglas Oliver Powell, David John Russell
Life of this patent
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Abstract
An approach is provided in which a laminate substrate includes top layers, bottom layers, and a core layer. The top layers are positioned between the core layer and a top surface metallurgy (TSM) layer and include at least one top conductive layer. The bottom layers are positioned between the core layer and a bottom surface metallurgy (BSM) layer and include at least one bottom conductive layer includes a material void pattern that is based upon the top conductive layer and reduces warpage of the laminate substrate.
Claims11
A method comprising:
- retrieving a first layer design and a second layer design, the first layer design corresponding to a first conductive layer included in a laminate substrate and the second layer design corresponding to a second conductive layer included in the laminate substrate;
- identifying a first conductive material pattern in the first layer design;
- selecting a material void pattern based upon the first conductive material pattern;
- and
- including the selected material void pattern in the second layer design that removes a portion of conductive material from the second conductive layer, wherein the inclusion of the selected material void pattern reduces warpage of the laminate substrate.
A product made by a method comprising:
- retrieving a first layer design and a second layer design, the first layer design corresponding to a first conductive layer included in a laminate substrate and the second layer design corresponding to a second conductive layer included in the laminate substrate;
- identifying a first conductive material pattern in the first layer design;
- selecting a material void pattern based upon the first conductive material pattern;
- and
- including the selected material void pattern in the second layer design, wherein the material void pattern is adapted to remove a portion of conductive material from the second conductive layer and reduce warpage of the laminate substrate.
Dependencies are inferred from the claim text.