Projection exposure apparatus including mechanism to reduce influence of pressure fluctuations

An apparatus, comprising:

• an illumination system configured to illuminate a first object;
• a stage configured to move the first object;
• a projection lens configured to image the first object onto a second object;
• and
• a mechanism,
• wherein:
• during use of the apparatus, movement of the stage causes pressure fluctuations in a medium surrounding a portion of the apparatus;
• the mechanism is configured so that, during use of the apparatus, the mechanism at least partially decouples at least part of the portion of the apparatus from an influence of the pressure fluctuations in the medium surrounding the portion of the apparatus;
• the portion of the apparatus comprises at least one member selected from the group consisting of the illumination system and the projection lens;
• and
• the apparatus is a semiconductor lithography projection exposure apparatus.

A method using an apparatus comprising an illumination system, a projection lens, and a stage configured to move a mask, the method comprising:

• using the illumination system to at least partially illuminate the mask;
• and
• using the projection system to project at least a portion of the illuminated mask onto a semiconductor substrate,
• wherein the method further comprises:
• moving the mask;
• and
• using a mechanism to at least partially decouple at least part of the portion of the apparatus from an influence of pressure fluctuations in a medium surrounding the portion of the apparatus, the portion of the apparatus comprises at least one member selected from the group consisting of the illumination system and the projection lens, and pressure fluctuations in the medium surrounding the portion of the apparatus being due to movement of a stage supporting the mask.