Method of Preparing and Using Photosensitive Material
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsAn-Ren Zi, Chen-Hau Wu, Ching-Yu Chang
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Abstract
Provided in one embodiment is a method that includes selecting a photoresist that is one of a positive-tone photoresist and a negative-tone photoresist. A first additive or a second additive is selected based on the photoresist. The first additive has a fluorine component and a base component attached to a polymer and is selected if the a positive-tone resist is provided. The second additive has the fluorine component and an acid component attached to the polymer and is selected with a negative-tone resist is provided. The selected photoresist and the selected additive material are applied to a target substrate.
Claims19
A method of semiconductor device fabrication, comprising:
- providing a photoresist, wherein the photoresist is one of a positive-tone photoresist and a negative-tone photoresist;
- selecting an additive material, wherein the additive material is one of a first additive and a second additive, wherein the first additive has a fluorine component and a base component attached to a polymer;
- wherein the second additive has the fluorine component and an acid component attached to the polymer, wherein the selecting the additive includes:
- selecting the first additive if the providing the photoresist included providing the positive-tone resist and selecting the second additive if the providing the photoresist included selecting the negative-tone resist;
- and
- applying the provided photoresist and the selected additive material to a target substrate.
A method of semiconductor device fabrication, wherein the method comprises:
- forming a photosensitive layer on a target substrate;
- forming an additive layer on the photosensitive layer, wherein the additive layer includes an additive material;
- wherein the additive material includes a polymer having a fluorine unit and one of a base unit and an acid unit;
- and
- wherein the photosensitive layer includes the other one of the base unit and the acid unit;
- and
- exposing the target substrate having the photosensitive layer and additive layer disposed thereon to form an exposed region and an unexposed region of the photosensitive layer and the additive layer;
- and
- developing the target substrate after the exposing such that one of the exposed region and the unexposed region is removed from the target substrate.
A photolithography material, including:
- a positive-tone photoresist;
- and
- an additive material mixed with the positive-tone photoresist, wherein the additive material includes a polymer chain having a fluorine component and a base component bonded to the polymer chain.
Dependencies are inferred from the claim text.