Semiconductor apparatus, display panel, and method of manufacturing semiconductor apparatus
AssigneeSharp Kabushiki Kaisha
InventorsYudai TAKANISHI, Yukinobu NAKATA
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AssigneeSharp Kabushiki Kaisha
InventorsYudai TAKANISHI, Yukinobu NAKATA
Estimating the term…
The present invention prevents electric corrosion even when metal lines that may cause problems when in direct contact with ITO are used as source/drain lines, without increasing the number of steps for manufacturing a TFT substrate. A semiconductor apparatus includes TFTs that each include: a gate electrode included in a gate layer 11a provided on a substrate 20; a semiconductor element 15 provided above the gate layer 11a with a gate insulating film 21 positioned in between; and a source electrode and a drain electrode included in a source layer 12a located across the semiconductor element 15. The semiconductor apparatus includes, for a given TFT, a contact hole H1 formed in an interlayer insulating film 22 and planarizing film 23 stacked on the source layer 12a, and auxiliary line layer portions 13P and 13S made of a metal that can prevent electric corrosion between itself and ITO and located to overlap the associated source line, where a pixel electrode 17 is connected with the associated drain electrode 12D via the auxiliary line layer portion 13P. A common electrode 16 is provided to cover the auxiliary line layer portions 13S, and a potential is supplied to the common electrode 16 via the auxiliary line layer portions 13S.
1-8. (canceled)
A semiconductor apparatus comprising:
A method of manufacturing a semiconductor apparatus including a thin-film transistor, comprising:
Dependencies are inferred from the claim text.