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US 2015/0316719 A1Published application
Optical device and manufacturing method therefor
AssigneeInternational Business Machines Corporation
InventorsShigeru Nakagawa, Seiji Takeda
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Abstract
An optical device includes an SOI substrate, the embedded insulating layer having a thickness of 200 nanometers (nm) or less; an optical waveguide comprising a Group III-V compound semiconductor material formed on top of the SOI substrate; and an optical leakage preventing layer formed inside the SOI substrate on a bottom side of the optical waveguide to prevent leakage of light from inside the optical waveguide towards the SOI substrate.
Claims5
A method for manufacturing an optical device, the method comprising:
- etching an SOI substrate having an embedded insulating layer with a thickness of 200 nm or less to form a groove passing through the insulating layer from the surface of the SOI substrate;
- forming a Group III-V compound semiconductor layer;
- bonding together the SOI substrate with a formed groove and the Group III-V compound semiconductor layer so the opening of the groove faces the Group III-V compound semiconductor layer;
- and
- etching the Group III-V compound semiconductor layer to form an optical waveguide.
2 more elements
Dependencies are inferred from the claim text.