De-Embedding On-Wafer Devices

An apparatus comprising a plurality of devices and at least one structure for de-embedding at least one of the plurality of devices, wherein the at least one structure comprises:

• a first component including a first transmission line having a length 2 L;
• a second component including a second transmission line having a length L, wherein the second component is coupled with the first component;
• and
• a first pad electrically coupled to the first transmission line and a second pad electrically coupled to the second transmission line,
• wherein the first transmission line and the second transmission line are each comprised of:
• a substrate;
• a n-well within the substrate;
• a shielding layer over the n-well;
• a plurality of intermediate metal layers over the shielding layer, the plurality of intermediate metal layers coupled by a plurality of vias;
• and
• a top metal layer over the plurality of intermediate metal layers.

An apparatus comprising:

• a first component including a first transmission line;
• and
• a second component coupled with the first component, wherein the second component includes a second transmission line, the second transmission line including:
• a substrate;
• a well within the substrate;
• a shielding layer over the well;
• a plurality of intermediate metal layers over the shielding layer, the plurality of intermediate metal layers coupled by a plurality of vias;
• and
• a top metal layer over the plurality of intermediate metal layers.