Semiconductor testing structures and fabrication method thereof

A semiconductor testing structure, comprising:

• a dummy wafer,
• an adhesive layer formed on the dummy wafer;
• a dielectric layer having a first surface bonded with the dummy wafer by the adhesive layer;
• and
• a to-be-tested device structure having an even and smooth surface formed in the dielectric layer with a surface exposed by a second surface of the dielectric layer relative to the first surface of the dielectric layer of the dielectric layer.

A semiconductor testing method, comprising:

• providing a semiconductor testing structure having a to-be-tested device structure with an even and smooth testing surface;
• providing a testing apparatus having a probe;
• and
• moving the probe of the testing apparatus on the testing surface of the to-be-tested device structure of the semiconductor testing structure to obtain testing information in the to-be-tested device structure,
• wherein the semiconductor testing structure includes:
• a dummy wafer,
• an adhesive layer formed on the dummy wafer;
• a dielectric layer having a first surface bonded with the dummy wafer by the adhesive layer;
• and
• a to-be-tested device structure formed in the dielectric layer with an even and smooth surface exposed by a second surface of relative to the first surface of the dielectric layer of the dielectric layer.