Infrared Sensor Having a Microstructure with a Plurality of Thermocouples and a Carrier Element

A method for producing a microstructure with a plurality of thermocouples and a carrier element, the method comprising:

• providing a substrate material, which forms a substrate for an integrated circuit;
• forming the integrated circuit on a rear side of the substrate material, the integrated circuit comprising at least one component;
• forming a plurality of wells, which extend from the rear side of the substrate material into the substrate material;
• arranging a first material with a first Seebeck coefficient in a respective interior space of a first predetermined number of the plurality of wells to form a respective first sensor element;
• arranging a second material with a second Seebeck coefficient in a respective interior space of a second predetermined number of the plurality of wells to form a respective second sensor element;
• and
• removing the substrate material, starting from a front side of the substrate material, and thereby exposing at least one region of the first sensor element, the second sensor element, or the first sensor element and the second sensor element.