Wavelength converting device
AssigneeNichia Corporation
InventorsJun KAWAMATA, Takao KOSUGI
Life of this patent
Estimating the term…
Abstract
(Problem to be Solved) To provide a wavelength converting device which can efficiently exhaust heat from the wavelength converting member using a heat dissipating member. (Solution) The wavelength converting device includes a heat dissipating member, a wavelength converting member disposed on the heat dissipating member, and a connecting member which connects the heat dissipating member and the wavelength converting member. Particularly, the wavelength converting member includes an upper surface, side surfaces, and a lower surface, and the connecting member is thermally connected to the side surfaces and the lower surface of the wavelength converting member.
Claims20
A wavelength converting device comprising:
- a heat dissipating member;
- a wavelength converting member disposed on the heat dissipating member;
- and
- a connecting member containing a metal material and connecting the heat dissipating member and the wavelength converting member;
- wherein the wavelength converting member includes an upper surface, side surfaces, and a lower surface;
- and
- the connecting member is thermally connected to the side surfaces and the lower surface of the wavelength converting member.
A method of manufacturing a wavelength converting device comprising:
- providing a wavelength converting member in a wafer state;
- forming a reflecting layer on a lower surface of the wavelength converting member;
- singulating the wavelength converting member into a plurality of elements wherein side surfaces of the wavelength converting member are inclined and expanded upward from the lower surface of the wavelength converting member to an upper surface of the wavelength converting member and side surfaces of the reflecting layer are inclined and expanded upward from a lower surface of the reflecting layer to an upper surface of the reflecting layer;
- forming an interposing layer containing a first metal material on the side surfaces of the wavelength converting member, on the side surfaces of the reflecting layer, and on the lower surface of the reflecting layer;
- and
- connecting a lower surface of the interposing layer and a heat dissipating member with a connecting member which contains a second metal material;
- wherein in the connecting, the side surfaces of the reflecting layer are covered with the connecting member that has crept up the side surfaces.
Dependencies are inferred from the claim text.