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US 2015/0315436 A1Published application
Adhesive agent, adhesive film, and semiconductor device and method for manufacturing same
AssigneeToray Industries, Inc.
InventorsKoichi FUJIMARU, Toshihisa NONAKA
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Abstract
The present invention relates to an adhesive agent which can be used in the mounting of a semiconductor chip on a circuit board or the like. The present invention addresses the problem of providing an adhesive agent having both excellent storage stability and excellent connection reliability. A means for solving the problem is an adhesive agent comprising (a) a polyamide, (b) an epoxy compound and (c) an acid-modified rosin.
Claims14
An adhesive agent comprising a polyimide (a), an epoxy compound (b), and an acid-modified rosin (c).
Dependencies are inferred from the claim text.