Surface mount device and method of manufacturing the same
AssigneeFujitsu Component Limited
InventorsTakeshi Okuyama, Toshihiro Kusagaya, Tohru Yamakami
Life of this patent
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Abstract
Disclosed is a surface mount device to be mounted on a base member, including plural lead units, each of the plural lead units including, a lead including a body portion and a foot formed at an end of the lead; a solder portion formed at the foot of the lead to protrude toward the direction of the base member to have a summit portion, and a diffusion prevention portion provided on the lead for preventing a diffusion of a solder along the body portion of the lead.
Claims8
A method of manufacturing a surface mount device to be mounted on a base member including plural lead units each including a lead composed of a body portion and a foot formed at an end of the lead and a diffusion prevention portion for preventing a diffusion of a solder provided on the lead, comprising:
- introducing solder into plural concave portions provided in a pallet and aligned to correspond to the leads of the plural lead units;
- contacting or inserting each of the leads into the solder introduced in the respective concave portion while the solder is melted by heating to form a solder portion at the foot of the lead to protrude toward the direction of the base member to have a summit portion.
Dependencies are inferred from the claim text.