Package, electronic device, method of manufacturing electronic device, electronic apparatus, and mobile body

An electronic device, comprising:

• an accommodation space portion;
• a first base body that forms at least a part of the accommodation space portion;
• and
• a functional element that is accommodated in the accommodation space portion,
• wherein a first through-hole, which extends toward a second surface on an accommodation space portion side from a first main surface opposite to the accommodation space portion, is provided in the first base body,
• in a cross-sectional view of the first through-hole, the first through-hole includes a first inclined portion that is inclined from the second surface toward a first main surface side, and a second inclined portion that is inclined from one end on a first main surface side of the first inclined portion toward the first main surface side,
• a second angle made by the second inclined portion and the second surface is larger than a first angle made by the first inclined portion and the second surface, and
• the first through-hole is sealed with a sealing member.

A method of manufacturing an electronic device, comprising:

• half-etching a first main surface of a first base body in a dry process;
• and
• forming a first inclined portion and a second inclined portion of a first through-hole through etching in a wet process,
• wherein the electronic device includes an accommodation space portion, the first base body that forms at least a part of the accommodation space portion, and a functional element that is accommodated in the accommodation space portion,
• the first through-hole, which extends toward a second surface on an accommodation space portion side from a first main surface opposite to the accommodation space portion, is provided in the first base body,
• in a cross-sectional view of the first through-hole, the first through-hole includes the first inclined portion that is inclined from the second surface toward a first main surface side, and the second inclined portion that is inclined from one end on a first main surface side of the first inclined portion toward the first main surface side,
• a second angle made by the second inclined portion and the second surface is larger than a first angle made by the first inclined portion and the second surface,
• the first through-hole is sealed with a sealing member,
• the first base body includes silicon as a main material, and
• the first main surface is formed along a (1,0,0) crystal face of silicon.

A method of manufacturing an electronic device, comprising:

• forming a first main surface of a first base body through etching of a wet process;
• and
• forming a second inclined portion of a first through-hole through etching of a dry process,
• wherein the electronic device includes an accommodation space portion, the first base body that forms at least a part of the accommodation space portion, and a functional element that is accommodated in the accommodation space portion,
• the first through-hole, which extends toward a second surface on an accommodation space portion side from a first main surface opposite to the accommodation space portion, is provided in the first base body,
• in a cross-sectional view of the first through-hole, the first through-hole includes the first inclined portion that is inclined from the second surface toward a first main surface side, and the second inclined portion that is inclined from one end on a first main surface side of the first inclined portion toward the first main surface side,
• a second angle made by the second inclined portion and the second surface is larger than a first angle made by the first inclined portion and the second surface,
• the first through-hole is sealed with a sealing member,
• the first base body includes silicon as a main material, and
• the first main surface is formed along a (1,0,0) crystal face of silicon.