Resin composition and its use
AssigneeShengyi Technology Co., Ltd.
InventorsGuangbing CHEN, Xianping ZENG
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Abstract
Disclosed in the present invention is a resin composition, comprising a modified polyphenylene ether resin and an organic silicon compound containing unsaturated double bonds. Also disclosed is a method for preparing a high-frequency circuit substrate using the resin composition as described above and a high-frequency circuit substrate obtained by the preparation method. The high-frequency circuit substrate of the present invention has a high glass transition temperature, a high thermal decomposition temperature, a high interlayer adhesive force, a low dielectric constant and a low dielectric loss tangent, and is very suitable as a circuit substrate in a high-frequency electronic device.
Claims21
A resin composition comprising a modified polyphenylether resin and an organic silicon compound containing unsaturated double bonds,
- wherein the organic silicon compound containing unsaturated double bonds is selected from the organic silicon compound structures containing unsaturated double bonds:
- wherein R21, R22 and R23 are independently selected from substituted/unsubstituted C1-C8 linear chain alkyl groups, substituted/unsubstituted C1-C8 branch chain alkyl groups, substituted/unsubstituted phenyl groups and substituted/unsubstituted C2-C10 C═C-containing groups;
- at least one of R21, R22 and R23 is substituted/unsubstituted C2-C10 C═C-containing groups;
- and 0≦m 100;
- or,
- wherein R24 is selected from substituted/unsubstituted C1-C12 linear chain alkyl groups and substituted/unsubstituted C1-C12 branch chain alkyl groups;
- 2≦n≦10, and n is a natural number.
(canceled)
Dependencies are inferred from the claim text.