Power module substrate, power module substrate with heat sink, power module, method of producing power module substrate, paste for copper sheet bonding, and method of producing bonded body
AssigneeMitsubishi Materials Corporation
InventorsNobuyuki Terasaki, Yoshiyuki Nagatomo, Kimihito Nishikawa
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Abstract
A power module substrate according to the present invention is a power module substrate in which a copper sheet made of copper or a copper alloy is laminated and bonded onto a surface of a ceramic substrate (11), an oxide layer (31) is formed on the surface of the ceramic substrate (11) between the copper sheet and the ceramic substrate (11), and the thickness of a Ag—Cu eutectic structure layer (32) is set to 15 μm or less.
Claims20
A power module substrate comprising:
- a ceramic substrate made of Al2O3;
- and a copper sheet made of copper or a copper alloy laminated and bonded onto a surface of the ceramic substrate, wherein
- an oxide layer is formed on the surface of the ceramic substrate between the copper sheet and the ceramic substrate and a thickness of a Ag—Cu eutectic structure layer is set to 15 μm or less.
A method of producing a power module substrate in which a copper sheet made of copper or a copper alloy is laminated and bonded onto a surface of a ceramic substrate made of Al2O3, the method comprising:
- a step of forming a Ag and oxide-forming element layer containing Ag and an oxide-forming element on at least one of a bonding surface of the ceramic substrate and a bonding surface of the copper sheet;
- a step of lamination of laminating the ceramic substrate and the copper sheet through the Ag and oxide-forming element layer;
- a step of heating of pressing and heating the laminated ceramic substrate and the copper sheet in a lamination direction to form a molten metal region at an interface between the ceramic substrate and the copper sheet;
- and
- a step of solidification of bonding the ceramic substrate and the copper sheet by solidifying the molten metal region, wherein
- the molten metal region is formed at the interface between the ceramic substrate and the copper sheet and an oxide layer is formed on the surface of the ceramic substrate by diffusing Ag toward the copper sheet in the step of heating.
A paste for copper sheet bonding used in bonding a copper sheet made of copper or a copper alloy and a ceramic substrate made of Al2O3, the paste comprising:
- a powder component including Ag and an oxide-forming element;
- a resin;
- and
- a solvent.
Dependencies are inferred from the claim text.