Multi-layer micro-wire structure
AssigneeEastman Kodak Company
InventorsTodd Mathew Spath, Ronald Steven Cok
Life of this patent
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Abstract
A multi-layer micro-wire structure resistant to cracking including a substrate having a surface, one or more micro-channels formed in the substrate, an electrically conductive first material composition forming a first layer located in each micro-channel, and an electrically conductive second material composition having a greater tensile ductility than the first material composition forming a second layer located in each micro-channel, the first material composition and the second material composition in electrical contact to form an electrically conductive multi-layer micro-wire in each micro-channel, whereby the multi-layer micro-wire is resistant to cracking
Claims20
A multi-layer micro-wire structure resistant to cracking, comprising:
- a substrate having a surface;
- one or more micro-channels formed in the substrate;
- an electrically conductive first material composition forming a first layer located in each micro-channel;
- and
- an electrically conductive second material composition having a greater tensile ductility than the first material composition forming a second layer located in each micro-channel, the first material composition and the second material composition in electrical contact to form an electrically conductive multi-layer micro-wire in each micro-channel, whereby the multi-layer micro-wire is resistant to cracking.
A capacitive touch screen that has a three-dimensional configuration, is curved, is wrapped around a corner or edge of a three-dimensional object or surface, or is adhered to a curved or three-dimensional surface.
Dependencies are inferred from the claim text.