Printed circuit board

Abstract

[Object] There is suggested a printed circuit board capable of realizing impedance matching by securing joint reliability between signal pins of a surface mount connector and signal pin pads and preventing the reduction of impedance of signal pin pads while minimizing the reduction of a wirable area. [Solution] A printed circuit board equipped with a signal pin pad, which is soldered to a signal pin from a surface mount connector, and a ground layer located as a lower layer below the signal pin pad; wherein a fillet is formed around a joint area between the signal pin and the signal pin pad after soldering; wherein a cut-out portion is provided in the signal pin pad within a joint area with the signal pin; and wherein the size of the cut-out portion is set within the range of being completely covered within the joint area with the signal pin based on size tolerance of the signal pin, fabrication tolerance of the printed circuit board, and mount position tolerance of the surface mount connector.

Dependencies are inferred from the claim text.