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US 2015/0311420 A1Published application
Thermoelectric module
AssigneeKYOCERA Corporation
InventorKenichi AKABANE
Life of this patent
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Abstract
A thermoelectric module includes a pair of support substrates; a wiring conductor disposed on each of one main faces opposing each other of the pair of support substrates; and thermoelectric elements electrically connected to the wiring conductor. A sealing member is disposed on a periphery of the region between the one main faces opposing each other of the pair of support substrates. The sealing member has a plurality of voids in an interior thereof.
Claims9
A thermoelectric module, comprising:
- a pair of support substrates disposed so as to face each other;
- a wiring conductor disposed on each of one main faces opposing each other of the pair of support substrates;
- a plurality of thermoelectric elements disposed in arrays in a region between the one main faces opposing each other of the pair of support substrates so as to be electrically connected to the wiring conductor;
- and
- a sealing member disposed on a periphery of the region between the one main faces opposing each other of the pair of support substrates,
- the sealing member having a plurality of voids in an interior thereof.
3 more elements
Dependencies are inferred from the claim text.