Led carrier and manufacturing method thereof
AssigneesLite-On Opto Technology (Changzhou) Co., Ltd., Lite-On Technology Corporation
InventorCHEN-HSIU LIN
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Abstract
An LED carrier includes a substrate, a metallic layer, an insulating layer, and a reflecting layer. The metallic layer is disposed on the substrate and has a die bonding region and a ring-shaped wiring region separated from the die bonding region. A region arranged between the die bonding region and the ring-shaped wiring region is defined as an insulating region. The insulating layer at least partially covers the insulating region. The reflecting layer is arranged above the die bonding region and at least partially covers the top surface of the insulating layer. Moreover, the instant disclosure also provides a manufacturing method of an LED carrier.
Claims25
An LED carrier for mounting at least one LED die, comprising:
- a substrate;
- a metallic layer disposed on the substrate and having a die bonding region and a ring-shaped wiring region, the ring-shaped wiring region arranged around the die bonding region and spaced apart from the die bonding region, a ring-shaped groove formed between the die bonding region and the ring-shaped wiring region;
- an insulating layer at least partially disposed in the ring-shaped groove;
- and
- a reflecting layer disposed above the die bonding region and at least partially covering the ring-shaped groove, wherein the at least one LED die is disposed on the reflecting layer and arranged in the die bonding region, and the at least one LED die is electrically connected to the ring-shaped wiring region.
An LED carrier for mounting at least one LED die, comprising:
- a substrate;
- a metallic layer having a first pattern and disposed on the substrate;
- and
- an insulating layer having a second pattern and disposed on the substrate, wherein the first pattern and the second pattern are complementary, such that a carrying region of the substrate for carrying the metallic layer and a carrying region of the substrate for carrying the insulating layer are complementary.
A manufacturing method of an LED carrier, comprising:
- providing a substrate;
- forming a metallic layer having a first pattern on the substrate;
- and
- forming an insulating layer having a second pattern on the substrate, wherein the second pattern is complementary to the first pattern.
Dependencies are inferred from the claim text.