Flip chip light emitting diode and method for manufacturing the same
AssigneeAdvanced Optoelectronic Technology, Inc.
InventorsCHING-HSUEH CHIU, YA-WEN LIN, PO-MIN TU, SHIH-CHENG HUANG
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Abstract
A flip-chip light emitting diode, including a substrate, an N-type semiconductor layer, a light emitting layer and a P-type semiconductor layer series mounted along a height direction of the flip-chip light emitting diode. A P electrode is formed on the P-type semiconductor layer and an N electrode is formed on the N-type semiconductor. A top surface of the substrate is away from the light emitting layer. A plurality of micron main portions is formed on the top surface. An outer surface of each main body has a plurality of nanometer protrusions. A method for manufacturing the flip chip light emitting diode is also provided.
Claims20
A flip chip light emitting diode comprising:
- a P electrode;
- an N electrode;
- a P-type semiconductor mounted on the P electrode;
- a light emitting layer mounted on the P-type semiconductor;
- an N-type semiconductor mounted on the light emitting layer and on the N electrode;
- and
- a substrate mounted on the N-type semiconductor, the substrate having a first surface substantially facing towards the N-type semiconductor and a second surface, opposite the first surface, facing away from the N-type semiconductor;
- wherein, a microstructure is formed on the second substrate surface, the microstructure including a plurality of micron main portions with a plurality of nanometer protrusions protruding from an outer surface of each micron main portion.
A method for manufacturing the flip chip light emitting diode, comprising:
- providing a semi-finished flip chip light emitting diode including the substrate, a buffer layer, the N type semiconductor layer, the P type semiconductor layer, the light emitting layer located between the N type semiconductor layer and the P type semiconductor;
- providing nano-balls made from silica and attaching the nano-balls on the outer surface of the micron main portions;
- transferring printing the nano-balls in the micron main portions;
- and
- removing the nano-balls from the micron main portions to forming the nanometer protrusions on the top surface of the micron main portions.
Dependencies are inferred from the claim text.