Light emitting device
AssigneeNichia Corporation
InventorsAkinori YONEDA, Akiyoshi KINOUCHI, Hisashi KASAI, Yoshiyuki AIHARA, Hirokazu SASA, Shinji NAKAMURA
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AssigneeNichia Corporation
InventorsAkinori YONEDA, Akiyoshi KINOUCHI, Hisashi KASAI, Yoshiyuki AIHARA, Hirokazu SASA, Shinji NAKAMURA
Estimating the term…
A light emitting device includes a semiconductor chip including a p-type semiconductor layer and an n-type semiconductor layer, the semiconductor chip being adapted to emit light between the p-type semiconductor layer and the n-type semiconductor layer; a p-side pad electrode disposed on an upper surface side of the semiconductor chip and over the p-type semiconductor layer; an n-side pad electrode disposed on an upper surface side of the semiconductor chip and over the n-type semiconductor layer; a resin layer disposed to cover the upper surface of the semiconductor chip; a p-side connection electrode and an n-side connection electrode disposed at an outer surface of the resin layer and positioned on the upper surface side of the semiconductor chip; and a metal wire disposed in the resin. The metal wire is adapted to make connection at least one of between the p-side pad electrode and the p-side connection electrode, and between the n-side pad electrode and the n-side connection electrode.
A light emitting device comprising:
Dependencies are inferred from the claim text.