Light-emitting diode package and method of manufacturing the same

A Light-Emitting Diode (LED) package, comprising:

• an LED configured to provide light of a wavelength having a specific region;
• a plurality of bonding pads formed on a top of the LED;
• a circuit board disposed under the LED and electrically connected to the LED through the plurality of bonding pads;
• a phosphor layer formed as a cap, disposed to surround sides and a top of the LED, and configured to have the sides and the top thereof formed to a uniform thickness, wherein if the phosphor layer is disposed to surround the sides and the top of the LED, bonding holes are formed at the top of the phosphor layer so that the plurality of bonding pads are exposed;
• and
• a buffer layer disposed in regions other than regions in which the plurality of bonding pads between the top of the LED and a bottom of the phosphor layer have been formed, wherein the buffer layer is configured to suppress heat, generated from the top of the LED, from being transferred to the bottom of the phosphor layer and to prevent the bottom of the phosphor layer from being deviated from the top of the LED.

A method of manufacturing a Light-Emitting Diode (LED) package, comprising:

• mounting, on a circuit board, an LED configured to provide light of a wavelength having a specific region and to have bonding pads formed at a bottom of the LED;
• coating, on a top of the LED, a buffer layer configured to suppress heat, generated from the top of the LED, from being transferred upwardly and to prevent elements to be attached from being deviated from the top of the LED;
• and
• disposing a phosphor layer formed as a cap and configured to have sides and a top thereof formed to a uniform thickness so that the phosphor layer surrounds the sides and the top of the LED, and attaching the phosphor layer to a top of the buffer layer.

A method of manufacturing a Light-Emitting Diode (LED) package, comprising:

• mounting, on a circuit board, an LED configured to provide light of a wavelength having a specific region, wherein the LED has bonding pads formed on a top of the LED;
• coating, on regions on the top of the LED other than regions in which the bonding pads have been formed, a buffer layer, wherein the buffer layer is configured to suppress heat, generated from the top of the LED, from being transferred upwardly and to prevent elements to be attached from being deviated from the top of the LED;
• and
• disposing a phosphor layer formed as a cap so that the phosphor layer surrounds sides and the top of the LED and configured to have sides and a top thereof formed to a uniform thickness and to have bonding holes formed on the top of the phosphor layer so that the bonding pads of the LED are exposed, and attaching the phosphor layer to a top of the buffer layer.