Optoelectronic Semiconductor Component
AssigneeOSRAM Opto Semiconductors GmbH
InventorsMichael BINDER, Alexander Linkov, Thomas Zeiler, Peter Brick
Life of this patent
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Abstract
An optoelectronic semiconductor component is provided, having a connection carrier (2), an optoelectronic semiconductor chip (1), which is arranged on a mounting face (22) of the connection carrier (2), and a radiation-transmissive body (3), which surrounds the semiconductor chip (1), wherein the radiation-transmissive body (3) contains a silicone, the radiation-transmissive body (3) has at least one side face (31) which extends at least in places at an angle β of <90° to the mounting face (22) and the side face (3) is produced by a singulation process.
Claims14
A method of producing an optoelectronic semiconductor component, comprising the following steps:
- providing a connection carrier with a mounting face;
- attaching and electrically contacting an optoelectronic semiconductor chip to the mounting face;
- molding a radiation-transmissive body around the optoelectronic semiconductor chip;
- and
- sawing the radiation-transmissive body at an angle of <90° to the mounting face of the connection carrier in order at least in places to produce a side face of the radiation-transmissive body;
- wherein the side face extends at least in places at an angle of less than 90° to the mounting face of the connection carrier;
- and
- wherein the radiation-transmissive body surrounds the semiconductor chip in such a way that the radiation-transmissive body envelops outer faces of the optoelectronic semiconductor chip not facing the connection carrier in form-fitting manner.
The method according to claim 8, wherein the connection carrier comprises a base member, wherein the radiation-transmissive body directly adjoins the mounting face of the connection carrier.
An optoelectronic semiconductor component comprising:
- a connection carrier with a mounting face and an electrically insulating base member;
- an optoelectronic semiconductor chip, which is arranged on the mounting face of the connection carrier;
- and
- a radiation-transmissive body having four side faces, wherein the radiation-transmissive body surrounds the semiconductor chip in such a way that the radiation-transmissive body envelops outer faces of the optoelectronic semiconductor chip not facing the connection carrier in form-fitting manner, wherein the radiation-transmissive body comprises at least one side face which extends at least in places at an angle of between 60° and 70° to the mounting face, and
- wherein the base member has a thickness of at most 250 μm.
An optoelectronic semiconductor component comprising:
- a connection carrier with a mounting face;
- an optoelectronic semiconductor chip, which is arranged on the mounting face of the connection carrier;
- and
- a radiation-transmissive body having four side faces,
- wherein the radiation-transmissive body surrounds the semiconductor chip in such a way that the radiation-transmissive body envelops outer faces of the optoelectronic semiconductor chip not facing the connection carrier in form-fitting manner, wherein the radiation-transmissive body comprises at least one side face which extends at least in places at an angle of less than 90° to the mounting face, and wherein the optoelectronic semiconductor chip is arranged non-centered relative to the radiation-transmissive body.
Dependencies are inferred from the claim text.