Light receiving device and method for manufacturing light receiving device
AssigneeSumitomo Elctric Industries, Ltd.
InventorsYukihiro TSUJI, Hiroshi Inada
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AssigneeSumitomo Elctric Industries, Ltd.
InventorsYukihiro TSUJI, Hiroshi Inada
Estimating the term…
A light receiving device includes a mesa structure including a light absorption layer disposed on a semiconductor region; a passivation film disposed on a side surface of the mesa structure, the passivation film containing oxygen; and a nitriding layer disposed between the side surface of the mesa structure and the passivation film. The light absorption layer includes a super-lattice structure including first semiconductor layers and second semiconductor layers that are alternately stacked. The first semiconductor layer is made of a III-V group compound semiconductor. The second semiconductor layer is made of a III-V group compound semiconductor that is different from the III-V group compound semiconductor of the first semiconductor layer. The first semiconductor layer contains antimony as a group V constituent element. In addition, the nitriding layer is made of a nitride containing a group III constituent element of the first semiconductor layer and/or the second semiconductor layer.
A light receiving device comprising:
A method for manufacturing a light receiving device, comprising the steps of:
Dependencies are inferred from the claim text.