Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorsYoshiaki TOYODA, Hideaki KATAKURA
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AssigneeFuji Electric Co., Ltd.
InventorsYoshiaki TOYODA, Hideaki KATAKURA
Estimating the term…
A semiconductor device can ensure predetermined current capacity under maintaining breakdown voltage characteristics and can promote size reduction. A first n-type offset-diffusion-region is disposed inside a p-type well region. In the first n-type offset-diffusion-region, a LOCOS film is disposed on the surface layer of a part sandwiched between an n+-type drain region and n+-type source region. In the first n-type offset-diffusion-region, a gate electrode is disposed on the part sandwiched between the LOCOS film and the n+-type source region. In the first n-type offset-diffusion-region, impurity concentration is lower at the part beneath the gate electrode than at the part beneath the LOCOS film. Inside the first n-type offset-diffusion-region, a second n−-type offset-diffusion-region is disposed at apart located toward the n+-type source region through the LOCOS film so as to be separated from the LOCOS film by a distance x.
A semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.