Semiconductor device and manufacturing method thereof
AssigneeSemiconductor Manufacturing International (Shanghai) Corporation
InventorZhenghao GAN
Life of this patent
Estimating the term…
Loading patent…
AssigneeSemiconductor Manufacturing International (Shanghai) Corporation
InventorZhenghao GAN
Estimating the term…
A method of manufacturing a semiconductor device is provided. The method includes providing a substrate; forming a well region on the substrate; forming at least one first gate structure on the well region, wherein the first gate structure includes a gate insulating layer and a first gate electrode formed on the gate insulating layer, wherein the first gate electrode is formed having a first enclosed pattern on a surface of the well region; wherein an area inside the first enclosed pattern is defined as a first region, and an area outside the first enclosed pattern is defined as a second region; performing ion implantation on the first region such that the first region has a first conductivity type, and performing ion implantation on the second region such that the second region has a second conductivity type, wherein the first conductivity type and the second conductivity type are different.
A method of manufacturing a semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.