Landside embedded inductor for fanout packaging

A device, comprising:

• an interconnect layer having a first surface and a second surface opposite each other;
• one or more dies on the first surface of the interconnect layer;
• one or more balls on the second surface of the interconnect layer, said one or more balls each having a height perpendicular to the second surface of the interconnect layer and one or more outer surfaces, the outer surfaces of at least some of said one or more balls and the second surface of the interconnect layer forming a landside region;
• and
• one or more three-dimensional inductors comprising one or more toroids occupying at least a portion of the height of said one or more balls and one or more magnets within the landside region.

A method of making an integrated circuit package, comprising the steps of:

• forming a first patterned conductive layer on a panel;
• forming a first dielectric layer on the first patterned conductive layer;
• forming a magnet on the first dielectric layer;
• forming a second dielectric layer on the magnet;
• and
• forming a second patterned conductive layer on the second dielectric layer, wherein the first patterned conductive layer, the second patterned conductive layer and the magnet together constitute at least a portion of a three-dimensional inductor.