US 2015/0311249 A1Published application

Chip-scale packaged led device

AssigneesLite-On Opto Technology (Changzhou) Co., Ltd., Lite-On Technology Corporation

InventorsMING-KUN WENG, KUO-MING CHIU, SHIH-CHIANG YEN, MENG-SUNG CHOU, CHEN-HSIU LIN

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Abstract

An LED device includes a substrate, a number (N) of flip-chip LED die(s), an electrical conductive structure and a lens structure. The substrate has upper and lower surfaces and is formed with multiple through holes. A ratio of LED die(s) surface area to an area of the upper surface of the substrate ranges from 22.7% to 76.2%. The electrical conductive structure includes a number (N) of upper bonding pad assembly (assemblies), a number (N+1) of lower bonding pads and a number (2N) of interconnectors. Each upper bonding pad assembly includes two upper bonding pads electrically connected to the LED die(s). The interconnectors are disposed in the through holes and interconnect the upper and lower bonding pads. The lens structure covers the LED die(s).

Claims20

Dependent claims

A chip-scale packaged LED device, comprising:

a substrate having an upper surface and a lower surface opposite to said upper surface, and being formed with a plurality of through holes that are defined between said upper and lower surfaces and that penetrate through said substrate;
a number (N) of flip-chip LED die (s) disposed on said upper surface of said substrate, each of said flip-chip LED die(s) including a positive electrode and a negative electrode, a ratio of an overall surface area of (N) number of said flip-chip LED die(s) to an area of said upper surface of said substrate ranging from 22.7% to 76.2%;
an electrical conductive structure including
a number (N) of upper bonding pad assembly (assemblies), each of which includes two upper bonding pads that are spaced apart from each other, said upper bonding pad assembly (assemblies) being disposed on said upper surface of said substrate so as to permit said flip-chip LED die(s) to be correspondingly disposed on said upper bonding pad assembly (assemblies), said two upper bonding pads of each of said upper bonding pad assembly (assemblies) being correspondingly and electrically connected to said positive and negative electrodes of a corresponding one of said flip-chip LED die(s),
a number (N+1) of lower bonding pads spaced apart from one another and disposed on said lower surface of said substrate, and
a number (2N) of interconnectors, each of which is disposed in a corresponding one of said through holes and interconnects corresponding ones of said upper and lower bonding pads;
and
a lens structure disposed on said upper surface of said substrate and covering said flip-chip LED die(s).

5 more elements

A chip-scale packaged LED device, comprising:

a substrate having an upper surface and a lower surface opposite to said upper surface, and being formed with a plurality of through holes that are defined between said upper and lower surfaces and that penetrate through said substrate;
an electrical conductive structure including
two upper bonding pads that define a first pattern and that are spaced apart from each other and disposed on said upper surface of said substrate,
two lower bonding pads that are spaced apart from each other and that are disposed on said lower surface of said substrate, and
two interconnectors, each of which is disposed in a corresponding one of said through holes and interconnects said upper and lower bonding pads;
an insulation layer that defines a second pattern complementary to said first pattern and that is disposed on said upper surface of said substrate, said two upper bonding pads being flush with said insulation layer;
a flip-chip LED die being disposed on said upper surface of said substrate and being electrically connected to said upper bonding pads, a ratio of a surface area of said flip-chip LED die to an area of said upper surface of said substrate ranging from 22.7% to 76.2%;
and
a lens structure disposed on said upper surface of said substrate and covering said flip-chip LED die.

6 more elements

Dependencies are inferred from the claim text.