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US 2015/0311203 A1Published application
Semiconductor device
AssigneeSemiconductor Manufacturing International (Shanghai) Corporation
InventorsShicheng DING, Fenghua FU
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Abstract
A semiconductor device is provided. The semiconductor device includes a semiconductor substrate, and a core device and a dummy device disposed on the semiconductor substrate. The core device includes a first gate disposed on the semiconductor substrate and a first stress layer disposed on opposing sides of the first gate. The dummy device includes a second gate disposed on the semiconductor substrate and a second stress layer disposed on opposing sides of the second gate.
Claims11
A semiconductor device comprising:
- a semiconductor substrate;
- and
- a core device and a dummy device disposed on the semiconductor substrate,
- wherein the core device includes a first gate disposed on the semiconductor substrate and a first stress layer disposed on opposing sides of the first gate, and
- the dummy device includes a second gate disposed on the semiconductor substrate and a second stress layer disposed on opposing sides of the second gate.
2 more elements
Dependencies are inferred from the claim text.