Light emitting diode package structure
AssigneeGenesis Photonics Inc.
InventorsMeng-Ting Tsai, Hao-Chung Lee, Yu-Feng Lin
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Abstract
A light emitting diode (LED) package structure including a carrier substrate, a LED and an electrostatic protection device is provided. The carrier substrate includes two leadframes separated from each other and a reflective member. The reflective member encapsulates the leadframes and exposes a carrier surface of each of the leadframes. The reflective member has a cavity, and a bottom surface of the cavity is aligned with the carrier surface of each of the leadframes. The LED is disposed inside the cavity and bridges the leadframes. The electrostatic protection device is disposed inside the cavity and bridges the leadframes. The LED is connected in anti-parallel to the electrostatic protection device.
Claims13
A light emitting diode package structure, comprising:
- a carrier substrate, comprising two leadframes separated from each other and a reflective member, wherein the reflective member encapsulates the leadframes and exposes a carrier surface of each of the leadframes, the reflective member has a cavity, and a bottom surface of the cavity is aligned with the carrier surface of each of the leadframes;
- a light emitting diode, disposed inside the cavity, and electrically bridging the leadframes;
- and
- an electrostatic protection device, disposed inside the cavity, and electrically bridging the leadframes, wherein the light emitting diode is connected in anti-parallel to the electrostatic protection device.
Dependencies are inferred from the claim text.