Method of manufacturing stacked semiconductor package

A method of manufacturing a stacked semiconductor package, the method comprising:

• forming a lower semiconductor package;
• and
• stacking an upper semiconductor package on the lower semiconductor package,
• wherein forming the lower semiconductor package includes:
• mounting one or more semiconductor chips on an upper surface of a PCB,
• forming first solder balls on the upper surface of the PCB,
• forming a mold layer covering the upper surface of the PCB and the first solder balls,
• marking the lower semiconductor package with an identification mark by scanning a laser of a laser supply apparatus onto the lower semiconductor package,
• controlling a focus level of the laser,
• performing laser drilling on the mold layer of the lower semiconductor package to form openings, and
• forming second solder balls on a lower surface of the PCB.

A method of manufacturing a stacked semiconductor package, the method comprising:

• forming a semiconductor package, the semiconductor package including:
• one or more semiconductor chips on an upper surface of a printed circuit board (PCB), and
• a mold layer covering the upper surface of the PCB;
• marking the semiconductor package with an identification mark by scanning a laser of a laser supply apparatus onto the semiconductor package;
• controlling a focus level of the laser;
• and
• drilling the mold layer of the semiconductor package by scanning the laser of the laser supply apparatus onto the semiconductor package to form openings through the mold layer.