Stacked semiconductor die assemblies with die support members and associated systems and methods
AssigneeMicron Technology, Inc.
InventorsSeng Kim Ye, Hong Wan Ng
Life of this patent
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Abstract
Stacked semiconductor die assemblies with die support members and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a package substrate, a first semiconductor die attached to the package substrate, and a support member attached to the package substrate. The support member can be separated from the first semiconductor die, and a second semiconductor die can have one region coupled to the support member and another region coupled to the first semiconductor die.
Claims19
A semiconductor die assembly, comprising:
- a package substrate;
- a first semiconductor die attached to the package substrate;
- a support member attached to the package substrate, wherein the support member is separated from the first semiconductor die on the package substrate;
- and
- a second semiconductor die having one region coupled to the support member and another region coupled to the first semiconductor die.
A semiconductor die assembly, comprising:
- a package substrate;
- a support member on the package substrate;
- a controller die on the package substrate and spaced laterally apart from the support member;
- and
- a memory die mounted to the support member and the controller die,
- wherein the controller die is partially superimposed within a footprint of the memory die.
19-35. (canceled)
Dependencies are inferred from the claim text.