Stacked semiconductor die assemblies with support members and associated systems and methods
AssigneeMicron Technology, Inc.
InventorsHong Wan Ng, Seng Kim Ye
Life of this patent
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Abstract
Stacked semiconductor die assemblies with support members and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a package substrate, a first semiconductor die attached to the package substrate, and a plurality of support members also attached to the package substrate. The plurality of support members can include a first support member and a second support member disposed at opposite sides of the first semiconductor die, and a second semiconductor die can be coupled to the support members such that at least a portion of the second semiconductor die is over the first semiconductor die.
Claims20
A semiconductor die assembly, comprising:
- a package substrate;
- a first semiconductor die attached to the package substrate;
- a plurality of support members attached to the package substrate, the plurality of support members including a first support member and a second support member disposed on opposite sides of the first semiconductor die;
- and
- a second semiconductor die coupled to the plurality of support members such that at least a portion of the second semiconductor die is over the first semiconductor die.
A semiconductor die assembly, comprising:
- a package substrate;
- a memory die;
- a plurality of support members attached to the package substrate and the memory dies, wherein the memory die is spaced apart from the package substrate;
- and
- a controller die on the package substrate, wherein the controller die is between the package substrate and the memory die.
20-37. (canceled)
Dependencies are inferred from the claim text.