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US 2015/0311182 A1Published application
Semiconductor package and method for manufacturing the same
AssigneeSK hynix Inc.
InventorsJeong Hwan LEE, Tac Keun OH
Life of this patent
Estimating the term…
Abstract
A semiconductor package may include an interposer; a first semiconductor chip disposed on a first surface of the interposer and at least one second semiconductor chip disposed at a predefined distance from the first semiconductor chip, a molding part filling spaces between the first semiconductor chip and the at least one second semiconductor chip and having a trench hole formed therein, and a thermal expansion buffer pattern filling the trench hole.
Claims20
A semiconductor package comprising:
- an interposer;
- a first semiconductor chip disposed on a first surface of the interposer and at least one second semiconductor chip disposed on the first surface and at a predefined distance from the first semiconductor chip;
- a molding part filling spaces between the first semiconductor chip and the at least one second semiconductor chip and having a trench hole formed therein;
- and
- a thermal expansion buffer pattern filling the trench hole.
2 more elements
A semiconductor package comprising:
- an interposer;
- a first semiconductor chip disposed on a first surface of the interposer and a plurality of second semiconductor chips disposed at a predefined distance from the first semiconductor chip;
- a molding part filling spaces between the first semiconductor chip and the second semiconductor chips and having an outer portion positioned substantially in line with an outer portion of the interposer;
- and
- a plurality of trench holes formed in the molding part.
2 more elements
Dependencies are inferred from the claim text.