Integrated circuit system with debonding adhesive and method of manufacture thereof

A method of manufacture of an integrated circuit system comprising:

• providing a wafer having a through-silicon via, the wafer having a top side and a bottom side;
• mounting a top interconnect to the through-silicon via at the top side;
• mounting an interconnect pillar to the through-silicon via at the bottom side;
• attaching a device interconnect to the interconnect pillar;
• forming a base adhesive covering the interconnect pillar and the device interconnect;
• and
• forming a die by singulating the wafer.

An integrated circuit system comprising:

• a die having a via, the die having a top side and a bottom side;
• a top interconnect mounted to the via at the top side;
• an interconnect pillar mounted to the via at the bottom side;
• a device interconnect mounted to the interconnect pillar;
• and
• a base adhesive covering the interconnect pillar and the device interconnect.