Stacked chip package and method for forming the same
AssigneeXintec Inc.
InventorsYen-Shih HO, Chih-Wei HO, Tsang-Yu LIU
Life of this patent
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Abstract
A stacked chip package is provided. The stacked chip package includes a first substrate having a first side and a second side opposite thereto. The first substrate includes a recess therein. The recess adjoins a side edge of the first substrate. A plurality of redistribution layers is disposed on the first substrate and extends onto the bottom of the recess. A second substrate is disposed on the first side of the first substrate. A plurality of bonding wires is correspondingly disposed on the redistribution layers in the recess, and extends onto the second substrate. A device substrate is disposed on the second side of the first substrate. A method of forming the stacked chip package is also provided.
Claims20
A stacked chip package, comprising:
- at least one first substrate having a first side and a second side opposite thereto, wherein the at least one first substrate comprises:
- a recess in the at least one first substrate and adjoining a side edge of the at least one first substrate;
- and
- a plurality of redistribution layers disposed on the at least one first substrate and extending onto a bottom of the recess;
- at least one second substrate disposed on the first side of the at least one first substrate;
- a plurality of bonding wires correspondingly disposed on the plurality of redistribution layers in the recess, and extending onto the at least one second substrate;
- and
- at least one device substrate disposed on the second side of the at least one first substrate.
A method for forming a stacked chip package, comprising:
- providing at least one first substrate having a first side and a second side opposite thereto, wherein the at least one first substrate comprises:
- a recess in the at least one first substrate and adjoining a side edge of the at least one first substrate;
- and
- a plurality of redistribution layers disposed on the at least one first substrate and extending onto a bottom of the recess;
- providing at least one second substrate on the first side of the at least one first substrate;
- forming a plurality of bonding wires correspondingly on the plurality of redistribution layers in the recess and extending onto the at least one second substrate;
- and
- providing at least one device substrate on the second side of the at least one first substrate.
Dependencies are inferred from the claim text.