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US 2015/0311171 A1Published application
Electronic component and electronic device
AssigneeFujitsu Limited
InventorsSeiki SAKUYAMA, Toshiya Akamatsu, Nobuhiro Imaizumi, Keisuke Uenishi, Kenichi Yasaka, Toru Sakai
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Abstract
A surface of a connection terminal of an electronic component is covered with a protection layer made of a AgSn alloy. The electronic component is soldered to a connection terminal of a circuit board.
Claims10
An electronic component comprising a connection terminal to be soldered to a different electronic component, wherein a surface of the connection terminal before being soldered to the different electronic component is directly covered with a protection layer made of a AgSn alloy.
An electronic device comprising:
- an electronic component;
- a circuit board having the electronic component mounted thereon;
- and
- solder bonding a connection terminal of the electronic component to a connection terminal of the circuit board, wherein
- a surface of at least one of the connection terminal of the electronic component and the connection terminal of the circuit board before being bonded to each other with the solder is directly covered with a protection layer made of a AgSn alloy.
2 more elements
Dependencies are inferred from the claim text.