Polymer Layers Embedded With Metal Pads for Heat Dissipation

A method comprising:

• forming a first package component comprising:
• forming a polymer layer over a semiconductor substrate, wherein an integrated circuit is formed at a surface of the semiconductor substrate;
• forming a first dummy metal pad in the polymer layer;
• and
• forming a first Under-Bump-Metallurgy (UBM) electrically coupled to the first dummy metal pad;
• and
• bonding the first UBM to a first metal pad in a second package component, wherein after the bonding, an electrically inter-coupled structure comprising the first dummy pad, the UBM, and the first metal pad is electrically floating.

A method comprising:

• forming a polymer layer over a dielectric layer;
• forming an opening in the polymer layer to expose a top surface of the dielectric layer, wherein all sidewall surfaces and all bottom surfaces of the opening are surfaces of dielectric materials;
• filling a metallic material into the opening to form a dummy metal pad;
• and
• forming a Post-Passivation Interconnect (PPI) over and electrically coupled to the dummy metal pad.