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US 2015/0311155 A1Published application
Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
AssigneeSeiko Epson Corporation
InventorHaruki ITO
Life of this patent
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Abstract
A semiconductor device is provided having a semiconductor element including a plurality of electrodes; first wirings coupled to the electrodes and directed toward a center of the semiconductor element from a portion coupled to the electrodes; second wirings coupled between the first wirings and external terminals, the second wirings being directed to an outer area of the semiconductor element relative to the center; and at least one resin layer formed between the first wirings and the second wirings.
Claims8
A semiconductor device comprising:
- a substrate;
- an electrode that is disposed over the substrate;
- a first wiring that is disposed over the substrate and electrically connected to the electrode,
- an insulating layer that is disposed over the first wiring,
- a second wiring that is disposed over the insulating layer and electrically connected to the first wiring through a hole in the insulating layer,
- a terminal that is disposed over the second wiring and electrically connected to the second wiring;
- wherein an angle between the first wiring and the second wiring is 90 degrees or less in a plan view of the substrate.
4 more elements
Dependencies are inferred from the claim text.