Tape wiring substrate, semiconductor package, and display apparatus including semiconductor package

A semiconductor package comprising:

• a semiconductor chip including an effective chip region at a center of the semiconductor chip and in which pads connected to chip wirings are formed, and a dummy chip region at a side of the effective chip region and in which pads not connected to the chip wirings are formed;
• a base film including a chip mounting section on which the semiconductor chip is mounted;
• and
• a plurality of wiring patterns disposed on the base film and electrically connected to the chip wirings of the semiconductor chip,
• wherein first wiring patterns, which are a part of the plurality of wiring patterns, extend on a first region of the chip mounting section corresponding to the dummy chip region.

A semiconductor package comprising:

• a semiconductor chip including an effective chip region in which effective pads connected to chip wirings are formed, and a dummy chip region at both sides of the effective chip region and in which dummy pads not connected to the chip wirings are formed;
• a base film on which the semiconductor chip is mounted, the base film including:
• a chip mounting section having an effective mounting region corresponding to the effective chip region and a dummy mounting region corresponding to the dummy chip region,
• a wiring section disposed at an outside of the chip mounting section,
• a perforation section which is on both sides of the wiring section and in which perforation holes are formed at regular intervals, and
• a bonding section bonded to an external device;
• and
• a plurality of wiring patterns electrically connected to the chip wirings of the semiconductor chip and wirings of the external device and formed in the dummy mounting region and the wiring section.