Semiconductor Package with Switch Node Integrated Heat Spreader

A semiconductor package comprising:

• a patterned conductive carrier;
• a control FET having a control drain attached to a first segment of said patterned conductive carrier;
• a sync FET having a sync source attached to a second segment of said patterned conductive carrier;
• a heat spreading conductive plate situated over a control source of said control FET and over a sync drain of said sync FET so as to couple said control source and said sync drain to a switch node segment of said patterned conductive carrier.

A method for fabricating a semiconductor package, said method comprising:

• providing a patterned conductive carrier;
• attaching a control drain of a control FET to a first segment of said patterned conductive carrier;
• attaching a sync source of a sync FET to a second segment of said patterned conductive carrier;
• situating a heat spreading conductive plate over a control source of said control FET and over a sync drain of said sync FET, said heat spreading conductive plate coupling said control source and said sync drain to a switch node segment of said patterned conductive carrier.