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US 2015/0311137 A1Published application
Chip Level Heat Dissipation Using Silicon
AssigneeOptiz, Inc.
InventorVage Oganesian
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Abstract
A semiconductor device that includes a semiconductor chip having a first silicon substrate with opposing first and second surfaces, a semiconductor device formed at or in the first surface, a plurality of first contact pads formed at the first surface which are electrically coupled to the semiconductor device, a layer of thermal conductive material on the second surface, and a plurality of first vias formed partially through the layer of thermal conductive material.
Claims19
A semiconductor device, comprising:
- a semiconductor chip, comprising:
- a first silicon substrate with opposing first and second surfaces,
- a semiconductor device formed at or in the first surface,
- a plurality of first contact pads formed at the first surface which are electrically coupled to the semiconductor device,
- a layer of thermal conductive material on the second surface, and
- a plurality of first vias formed partially through the layer of thermal conductive material.
3 more elements
Dependencies are inferred from the claim text.